Precision Die-Cut Polyimide (PI) Film Gaskets & Custom Shapes – 1mm Micro Rings & High-Tolerance Solutions
Product Introduction
Our precision die-cutting services provide high-performance Polyimide (PI) film components tailored to the most demanding technical requirements. Leveraging advanced rotary and flatbed die-cutting technology, we specialize in processing ultra-thin PI films into complex geometries.
Whether you need micro-sized 1mm PI rings for miniature electronics or intricate industrial insulators, we deliver exceptional edge quality and dimensional stability. We work strictly according to your CAD drawings and specified tolerances to ensure seamless integration into your assembly process.
Key Features
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Micro-Cutting Expertise: Specialized in producing micro-components, such as PI rings with a diameter as small as 1mm, with clean edges and no burrs.
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High Precision & Tight Tolerances: Capability to meet strict tolerance requirements (up to ±0.05mm or better depending on material thickness) to ensure perfect fitting.
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Customization to Drawings: Fully customizable shapes based on customer-provided technical drawings (DXF/DWG/PDF).
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Thermal & Chemical Excellence: Maintains mechanical properties from -269°C to +400°C; excellent dielectric strength and chemical resistance.
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Versatile Material Options: Available in various thicknesses (12.5μm to 125μm+) and types (Anti-static, Thermally conductive, or Standard Kapton-equivalent).
Applications
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Miniature Electronics: Micro-washers and insulators for sensors, acoustic components, and micro-motors.
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Semiconductor & PCB: High-temperature masking tapes and insulation dots for SMT processes and flexible printed circuits (FPC).
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Aerospace & Automotive: Lightweight, high-temperature insulation barriers for wire harnesses and engine sensors.
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Medical Devices: Precision gaskets for biocompatible and high-reliability diagnostic equipment.
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Battery Technology: Insulation wraps and gaskets for EV battery cells to prevent thermal runaway.
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Earphone Diaphragm Support: Precision-cut PI rings used as structural support or spacers for ultra-thin diaphragms in high-fidelity (Hi-Fi) earphones.
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Voice Coil Insulation: Micro-sized PI gaskets for insulating voice coils in miniature drivers, ensuring stable performance even under high-power heat.
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Acoustic Tuning & Dampening: Custom-shaped PI films with micro-perforations or specific geometries to control airflow and optimize sound frequency response.
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MEMS Microphones: Tiny PI components for internal insulation and structural integrity in compact MEMS microphone assemblies.